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General
Semiconductor Backed Gages
 Easy to install- Ideal for
prototyping
- Linearity
compensation for foil gage load cells and bridges
Mounted on a flexible insulated circuit with versatile solder pads makes
them easy to install. They can be bent without hurting the gage and will
perform like a foil gage except that the sensitivity change is 50 to 75
times greater.
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| On load cells and foil bridges, when
it is used as a linearity corrector, a non-linearity of 0.125 % FS can
be corrected to within .01 % of full scale. Long-term stability is not
compromised. Backed gages are suggested for use in prototyping for proof
of concept and for transient or high frequency measurements. |
| Backed gages are not suggested for use
when used in a full or half bridge when precision long term stability is
a requirement. Un-backed gages that are closely matched are suggested
for these applications. |
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Schematic |
|
 •Base material Duraver E-CU-104
•Dimensions base .30”x.13”
•Copper solder pads |
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| Standard
Gage Specifications |
| Material |
Czochralski pulled boron doped silicon. |
| Leads |
.002 dia. gold x 0.5 inch long. Some
gages have .0015 dia. leads. |
| Contact
Pad |
Gold nickel fused, aluminum, or Hi-Temp. |
| Lead
Attachment |
Parallel gap welded with epoxy
reinforcement or ball bonded. |
| Operating
Strain |
±2000 μ inch/inch ( 3000 μ inch/inch
max.) |
| Linearity |
Better than ±0.25% to 600 μ inch/inch
Better than ±1.5% to 1500 μ inch/inch |
| Max. Oper.
Temperature |
+278°F Bonded. |
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| |
| Backed
Bar Semiconductor Strain Gages |
|
PART NUMBER |
Width |
Lead
Type |
Thickness |
Resistance Ohms@78° F |
Gage
Factor |
TCGF* |
TCR*
|
|
SS-060-033-500 PB |
.008 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-13% |
15% |
|
SS-060-033-500 PUB |
.016 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-12% |
14% |
|
SS-060-033-1000PB |
.008 |
WL |
.0004 |
1050 ±75 |
155 ±10 |
-18% |
24% |
|
SS-080-050-120PB |
.008 |
WL |
.0004 |
120 ±20 |
120 ±10 |
-9% |
5% |
|
SS-080-050-230PB |
.008 |
WL |
.0004 |
230 ±30 |
120 ±10 |
-9% |
5% |
|
SS-080-050-345PB |
.008 |
WL |
.0004 |
345 ±40 |
140 ±10 |
-13% |
16% |
|
SS-080-050-500PB |
.008 |
WL |
.0004 |
540 ±50 |
140 ±10 |
-13% |
16% |
|
SS-095-060-350PUB |
.016 |
WL |
.0004 |
350 ±50 |
120 ±10 |
-9% |
5% |
|
SS-090-060-1150PB |
.008 |
WL |
.0004 |
1125 ±75 |
155 ±10 |
-18% |
24% |
|
SS-150-124-15PB |
.009 |
WL |
.0010 |
15 ±2 |
100 ±10 |
-10% |
6% |
|
SS-150-124-25PB |
.008 |
WL |
.0008 |
25 ±3 |
100 ±10 |
-10% |
6% |
|
SS-150-124-30PB |
.008 |
WL |
.0008 |
30 ±4 |
100 ±10 |
-10% |
6% |
|
SS-150-124-40PB |
.008 |
WL |
.0008 |
40 ±5 |
100 ±10 |
-10% |
6% |
|
SS-250-225-120PB |
.009 |
WL |
.0004 |
120 ±20 |
100 ±10 |
-10% |
6% |
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| |
Standard
Bridge Matching |
| Temperature °F
|
0° |
78° |
278° |
|
| Standard
Matching |
±0.6% |
±0.4% |
±0.4% |
Percent of Base Resistance |
|
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Semiconductor Strain Gage FAQ'S |
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Data Sheets
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